Polyamide Hot Melt Adhesive

Polyamide Hot Melt Adhesive

Description:

Polyamide hot-melt adhesive is reacted from dimer acid and diamine. This hot-melt adhesive has high bonding strength, good suppleness, high temperature resistance and good media resistance. This polyamide hot-melt adhesive is mainly used in fabric, leather, cable heat shrink sleeve, electrical union seal, adhesive and fix electron component. It is also be used for adhesive wood, plastic, metal, ceramic and so on
Performance: yellowish granula transparent solid. Non-toxic, no stimulation, can be soluble in most organic solvents, non-soluble in water.
Properties: polyamide hot-melt adhesive can be soluble in general organic solvents. It can be soluble and melt at low temperature, stable at high temperature, has good flexible property.